ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,933, issued on July 8, was assigned to EBARA Corp. (Tokyo).
"Plating method and plating apparatus" was invented by Kazuhito Tsuji (Tokyo) and Kentaro Yamamoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply th...