ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,339, issued on July 15, was assigned to EBARA Corp. (Tokyo).
"Plating apparatus and substrate holder operation method" was invented by Masaki Tomita (Tokyo) and Masaya Seki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plating module includes: a plating tank, a substrate holder, and an elevating mechanism. The plating tank is for housing a plating solution. The substrate holder is for holding a substrate with a surface to be plated facing downward. The elevating mechanism is for moving up and down the substrate holder. The substrate holder includes: a supporting mechanism, a floating plate, a floating mechanism, and a pushing mechanism. Th...