US Patent Issued to EBARA on July 15 for "Plate, apparatus for plating, and method of manufacturing plate" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,338, issued on July 15, was assigned to EBARA Corp. (Tokyo).

"Plate, apparatus for plating, and method of manufacturing plate" was invented by Yasuyuki Masuda (Tokyo), Ryosuke Hiwatashi (Tokyo) and Masashi Shimoyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to enhance the accuracy of porosity and/or the flexibility in adjustment of the porosity in each portion of a plate. There is provided a plate that is placed between a substrate and an anode in a plating tank. The plate comprises a pore forming area in which a plurality of pores are formed, wherein the pore forming area includes a center portion, a middle portion located ...