ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,954, issued on July 1, was assigned to EBARA Corp. (Tokyo).
"Plating apparatus" was invented by Yohei Wakuda (Tokyo), Yasuyuki Masuda (Tokyo) and Masashi Shimoyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a plating apparatus including a shielding member, an ionically resistive element is disposed to be close to a surface to be plated of a substrate to improve uniformity of a distribution of plating film-thickness.A plating apparatus includes: a plating tank 410 configured to house a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; an anode 430 disposed in the ...