US Patent Issued to EBARA on Jan. 28 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,733, issued on Jan. 28, was assigned to EBARA Corp. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Nobuyuki Takada (Tokyo) and Hozumi Yasuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the sub...