ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,994, issued on Feb. 10, was assigned to EBARA Corp. (Tokyo).
"Substrate processing method" was invented by Masayuki Satake (Tokyo) and Masayuki Nakanishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge po...