ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,026, issued on Feb. 10, was assigned to EBARA Corp. (Tokyo).
"Plating apparatus and plating method" was invented by Kazuhito Tsuji (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plating apparatus includes a plating tank configured to store a plating solution, a substrate holder configured to hold a substrate as a target on which a plating process is performed, a rotation mechanism that rotates the substrate holder, an elevating/lowering mechanism that elevates and lowers the substrate holder, and a control device, and the substrate holder includes a contact member configured to contact the substrate to be able to supply power to the substra...