US Patent Issued to EBARA on Dec. 30 for "Method of detecting abnormality in measuring of film thickness of workpiece, optical film-thickness measuring apparatus, and storage medium storing program" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,349, issued on Dec. 30, was assigned to EBARA Corp. (Tokyo).

"Method of detecting abnormality in measuring of film thickness of workpiece, optical film-thickness measuring apparatus, and storage medium storing program" was invented by Akira Nakamura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a pluralit...