US Patent Issued to EBARA on Dec. 23 for "Measuring film-thickness of a workpiece in a semiconductor processing apparatus using a composite spectrum" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,273, issued on Dec. 23, was assigned to EBARA Corp. (Tokyo).

"Measuring film-thickness of a workpiece in a semiconductor processing apparatus using a composite spectrum" was invented by Masaki Kinoshita (Tokyo) and Yoichi Shiokawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workp...