ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,677, issued on Dec. 16, was assigned to EBARA Corp. (Tokyo).
"Polishing apparatus and polishing method" was invented by Toshimitsu Sasaki (Tokyo), Keita Yagi (Tokyo) and Yoichi Shiokawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus capable of obtaining a desired film thickness profile is disclosed. The polishing apparatus includes: a polishing unit; a film thickness measuring device for measuring a film thickness profile of a substrate; and a controller for controlling at least operations of the polishing unit and the film thickness measuring device. The controller stores in advance a response model which is created by ...