ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,515, issued on Aug. 5, was assigned to EBARA Corp. (Tokyo).
"Polishing apparatus and polishing method" was invented by Yuta Suzuki (Tokyo) and Taro Takahashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus for performing polishing between a polishing pad and a semiconductor wafer disposed to face the polishing pad includes a polishing table for holding the polishing pad, a top ring for holding the semiconductor wafer, a swing arm for holding the top ring, and a swing shaft motor for causing the swing arm to swing. The polishing apparatus further includes an arm torque detection section that detects an arm torque imparted t...