US Patent Issued to EBARA, EBARA REFRIGERATION EQUIPMENT & SYSTEMS on May 13 for "Subfab area installation apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,520, issued on May 13, was assigned to EBARA Corp. (Tokyo) and EBARA REFRIGERATION EQUIPMENT & SYSTEMS Co. LTD. (Tokyo).

"Subfab area installation apparatus" was invented by Motoshi Kohaku (Tokyo), Yukihiro Fukusumi (Tokyo), Nobutaka Bannai (Tokyo), Hiromasa Miyata (Tokyo), Naoya Hanafusa (Tokyo), Ken Taoka (Tokyo) and Kazutomo Miyazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chambe...