ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,095, issued on Aug. 5, was assigned to EBARA Corp. (Tokyo) and EBARA REFRIGERATION EQUIPMENT & SYSTEMS Co. LTD. (Tokyo).

"Subfab area installation apparatus" was invented by Motoshi Kohaku (Tokyo), Yukihiro Fukusumi (Tokyo), Nobutaka Bannai (Tokyo), Hiromasa Miyata (Tokyo), Naoya Hanafusa (Tokyo), Ken Taoka (Tokyo) and Kazutomo Miyazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of ...