US Patent Issued to EATON INTELLIGENT POWER on Nov. 25 for "Thermal failure prediction module and method for solid state circuit protection device" (Pennsylvania, Wisconsin Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,022, issued on Nov. 25, was assigned to EATON INTELLIGENT POWER Ltd. (Dublin).

"Thermal failure prediction module and method for solid state circuit protection device" was invented by Jianyang Liu (Presto, Pa.), Andrew A. Rockhill (Waukesha, Wis.) and Xin Zhou (Wexford, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method are provided for protecting semiconductor components from thermal failure in an electronic circuit interrupter. The electronic trip unit (ETU) is configured to determine what range of current the detected current signal corresponds to, out of several ranges categorized as being either non-fault/normal, non-severe ...