US Patent Issued to Eaton Intelligent Power on June 24 for "Electrical panelboard assembly including power distribution heatsink assembly, systems and methods" (American, Indian Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,496, issued on June 24, was assigned to Eaton Intelligent Power Ltd. (Dublin).

"Electrical panelboard assembly including power distribution heatsink assembly, systems and methods" was invented by Jayram Desai (Maharashtra, India), Graig E. DeCarr (Cicero, N.Y.) and Michael Raddell (Phoenix, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A panelboard assembly for a harsh and/or hazardous environment is provided. The panelboard assembly includes a core assembly. The core assembly includes a main breaker assembly configured to be electrically connected to a power supply, and a branch breaker assembly electrically connected to the main breaker asse...