US Patent Issued to EAGLE TECHNOLOGY on May 20 for "Electronic assemblies having embedded passive heat pipes and associated method" (Florida Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,912, issued on May 20, was assigned to EAGLE TECHNOLOGY LLC (Melbourne, Fla.).

"Electronic assemblies having embedded passive heat pipes and associated method" was invented by Jason Thompson (Melbourne, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and...