ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,825, issued on Nov. 18, was assigned to E Ink Holdings Inc. (Hsinchu, Taiwan).
"Electronic device and wiring structure thereof" was invented by Yu-Lin Wang (Hsinchu, Taiwan) and Wei-Tsung Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substrate, a wiring structure, an oxide insulating layer and a nitride insulating layer. The wiring structure is disposed on the substrate and includes an outer metal layer and an inner metal layer. The outer metal layer contains no molybdenum. The inner metal layer disposed between the outer metal layer and the substrate contains molybdenum. The oxide insulating la...