US Patent Issued to Dyson Technology on Nov. 4 for "Method and apparatus for sputter deposition of target material to a substrate" (British Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,300, issued on Nov. 4, was assigned to Dyson Technology Ltd. (Wiltshire, Great Britain).

"Method and apparatus for sputter deposition of target material to a substrate" was invented by Michael Edward Rendall (Newbury, Great Britain) and Robert Ian Joseph Gruar (Swindon, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus for sputter deposition of target material to a substrate is disclosed. In one form, the apparatus includes a substrate guide arranged to guide a substrate along a curved path and a target portion spaced from the substrate guide and arranged to support target material. The target portion and the substrate guide defi...