US Patent Issued to DYNAX SEMICONDUCTOR on Nov. 25 for "Integrated package electronic device structure" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,767, issued on Nov. 25, was assigned to DYNAX SEMICONDUCTOR INC. (Kunshan, China).

"Integrated package electronic device structure" was invented by Xin Liu (Kunshan, China) and Shuyu Yan (Kunshan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of the present disclosure provides a new integrated package electronic device structure, including a packaging component, including a packaging frame and a packaging substrate, and at least two circuit modules, being packaged on one side of the packaging substrate within the packaging frame, wherein the packaging frame including a merge point for the at least two circuit modules. In the pre...