ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,348, issued on June 24, was assigned to DUPONT TORAY SPECIALTY MATERIALS K.K. (Tokyo).
"Thermal conductive silicone composition" was invented by Tomohiro Tamai (Ichihara, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive composition comprises: (A) an organopolysiloxane having 2 or more silicon atom-bonded alkenyl groups; (B) an organohydrogenpolysiloxane having 2 or more silicon atom-bonded hydrogen atoms; (C) a thermally conductive filler in an amount of 85 to 95% by mass based on the total mass of the composition; (D) a platinum group metal-based catalyst in an amount of 50 parts by mass or more of a platinum group metal ...