US Patent Issued to Dupont Toray Specialty Materials on Dec. 30 for "Thermal conductive silicone composition" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,585, issued on Dec. 30, was assigned to Dupont Toray Specialty Materials K.K. (Tokyo).

"Thermal conductive silicone composition" was invented by Tomohiro Tamai (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive silicone composition with good workability in a pin transfer process, and with which the cured product obtained has high adhesive strength and high heat dissipation. The composition includes (A) a straight-chain organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin; (C) organohydrogenpolysiloxane; (D) a heat dissipating filler powder mixture of ...