US Patent Issued to DuPont Electronic Materials International on Sept. 9 for "Nickel electroplating compositions for rough nickel" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,534, issued on Sept. 9, was assigned to DuPont Electronic Materials International LLC (Marborough, Mass.).

"Nickel electroplating compositions for rough nickel" was invented by Weigang Wu (Hung Hom, Hong Kong) and Fai Lung Ting (Solaris Kallang, Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Nickel electroplating compositions containing mercaptotetrazoles deposit rough nickel on substrates. The rough nickel can be electroplated over wide current density ranges. The rough nickel deposits enable improved adhesion to other metal layers in contrast to many conventional nickel deposits."

The patent was filed on Sept. 13, 2023, under Applicati...