ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,655, issued on May 6, was assigned to DuPont Electronic Materials Holding Inc. (Newark, Del.).
"Polishing composition and method of polishing a substrate having enhanced defect reduction" was invented by Yi Guo (Newark, Del.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An aqueous alkaline chemical mechanical polishing composition includes a quaternary ammonium compound having a phenyl group which enables enhanced reduction of defects on silicon oxide substrates and enables good silicon oxide removal rates during chemical mechanical polishing."
The patent was filed on April 27, 2021, under Application No. 17/241,399.
*For further information, inc...