ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,512, issued on May 13, was assigned to DOWA METALTECH Co. LTD. (Tokyo).
"Metal/ceramic bonding substrate and method for producing same" was invented by Hideyo Osanai (Tokyo) and Akira Sugawara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided an inexpensive metal/ceramic bonding substrate which has a metal circuit plate of aluminum or an aluminum alloy bonded directly to a ceramic substrate and which can prevent a large difference in level from being caused on portions corresponding to the grain boundaries of aluminum or the aluminum alloy even if heat cycles are repeatedly applied to the metal/ceramic bonding substrate, and a ...