US Patent Issued to DOWA ELECTRONICS MATERIALS on Sept. 30 for "Silver flake powder and production method thereof, and electrically conductive paste" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,570, issued on Sept. 30, was assigned to DOWA ELECTRONICS MATERIALS Co. LTD. (Tokyo).

"Silver flake powder and production method thereof, and electrically conductive paste" was invented by Takuya Kojima (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a flaky silver powder having a tapped density of from 0.8 g/mL to 1.9 g/mL, and a cumulative 50th percentile particle diameter (D50) of from 2 micro metre to 7 micro metre, where the cumulative 50th percentile particle diameter (D50) is measured by laser diffraction or laser scattering particle size analysis."

The patent was filed on March 1, 2022, under Application No. 18/27...