US Patent Issued to DOWA Electronics Materials on Jan. 20 for "Method of producing silver powder, silver powder, and conductive paste" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,122, issued on Jan. 20, was assigned to DOWA Electronics Materials Co. Ltd. (Tokyo).

"Method of producing silver powder, silver powder, and conductive paste" was invented by Kaori Tokusada (Honjo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of producing a silver powder and the silver powder that enable preparation of a conductive paste capable of forming a wiring pattern with desired line width and height. A method of producing a silver powder comprises: a disintegration step of disintegrating an agglomerated silver powder in an airflow type mill, and a classification step of classifying a silver powder after the disint...