US Patent Issued to DOWA Electronics Materials on Aug. 19 for "Silver powder, method of producing silver powder, and conductive paste" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,854, issued on Aug. 19, was assigned to DOWA Electronics Materials Co. Ltd. (Tokyo).

"Silver powder, method of producing silver powder, and conductive paste" was invented by Taro Torigoe (Okayama, Japan), Hiroaki Koubu (Honjo, Japan), Fumiya Abe (Takasaki, Japan) and Minami Kanasugi (Kosaka-machi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a silver powder that can reduce line resistance and a method of producing the same. The silver powder has a diameter at a cumulative value of 50% of 3 micro metre or more and a ratio of particles of 10 micro metre or larger of 10% or less. The silver powder includes flake-like particles havi...