US Patent Issued to DOW TORAY on Oct. 28 for "Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,615, issued on Oct. 28, was assigned to DOW TORAY Co. LTD. (Tokyo).

"Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure" was invented by Kenji Ota (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curable organopolysiloxane composition is provided. The composition provides an organopolysiloxane cured product that can be cured at low temperatures while having high thermal conductivity and that can achieve high initial adhesion and adhesive strength to various base materials in contact during the curing process. A thermally conductive member containing the composition, and a heat dissipat...