US Patent Issued to Dow Silicones on Oct. 28 for "Silicone hybrid pressure sensitive adhesive and methods for its preparation and use in protective films for (opto)electronic device fabrication" (South Korean, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,637, issued on Oct. 28, was assigned to Dow Silicones Corp. (Midland, Mich.).

"Silicone hybrid pressure sensitive adhesive and methods for its preparation and use in protective films for (opto)electronic device fabrication" was invented by Juyoung Yook (Chungcheongbuk-do, South Korea), Nanguo Liu (Midland, Mich.), Zachary Wenzlick (Midland, Mich.), Hojin Choi (Chungcheongbuk-do, South Korea) and Bo Kyung Bona Kim (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having...