US Patent Issued to Dow Silicones on June 17 for "Silicone adhesive composition and methods for its preparation and use for electronic device fabrication" (South Korean Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,229, issued on June 17, was assigned to Dow Silicones Corp. (Midland, Mich.).

"Silicone adhesive composition and methods for its preparation and use for electronic device fabrication" was invented by Gunn Jo (Chungcheongbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A UV curable silicone adhesive composition and method for its preparation are provided. The UV curable silicone adhesive composition is useful in electronic device fabrication for adhering components such as fingerprint sensors to substrates, such as OLED display devices."

The patent was filed on March 24, 2021, under Application No. 17/911,707.

*For further informa...