US Patent Issued to Dow Silicones on July 15 for "Highly thermally conductive flowable silicone composition" (Chinese, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,038, issued on July 15, was assigned to Dow Silicones Corp. (Midland, Mich.).

"Highly thermally conductive flowable silicone composition" was invented by Yan Zheng (Shanghai), Chen Chen (Shanghai), Dorab Bhagwagar (Auburn, Mich.), Peng Wei (Shanghai) and Qianqing Ge (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 2...