ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,599, issued on Dec. 23, was assigned to Dow Silicones Corp. (Midland, Mich.).
"Thermal conductive silicone composition" was invented by Chong Xing (Shanghai), Dorab Edul Bhagwagar (Auburn, Mich.), Qiang Huang (Shanghai), Lu Zou (Shanghai), Rui Yang (Shanghai) and Junmin Zhu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal conductive silicone composition is provided. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) an organopolysiloxane...