US Patent Issued to Dow Silicones on Dec. 23 for "Curable thermally conductive polysiloxane composition with increased thixotropic index" (Chinese, American Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,601, issued on Dec. 23, was assigned to Dow Silicones Corp. (Midland, Mich.).

"Curable thermally conductive polysiloxane composition with increased thixotropic index" was invented by Yan Huang (Shanghai), Dorab Bhagwagar (Midland, Mich.) and Zhongwei Cao (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; w...