ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,363, issued on Aug. 5, was assigned to DOW SILICONES Corp. (Midland, Mich.).
"Thermal conductive silicone composition" was invented by Debo Hong (Shanghai), Chong Xing (Shanghai) and Zhiting Liu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 micro metre; (C) a thermal conductive filler with an average particle size of at least 0.1 micro metre and less than 5 micro metre; and (D) a carbasi...