US Patent Issued to Dow Global Technologies on Jan. 13 for "Sealed multilayer structures and packages comprising sealed multilayer structures" (Singaporean, Malaysian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,965, issued on Jan. 13, was assigned to Dow Global Technologies LLC (Midland, Mich.).

"Sealed multilayer structures and packages comprising sealed multilayer structures" was invented by Wu Aik Yee (Singapore), Eng Kian Ma (Klang, Malaysia) and Hwee Lun Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is oriented in the machine direction at a draw rat...