US Patent Issued to Dow Global Technologies, Rohm and Haas on March 18 for "Multilayer structures with enhanced adhesive bonding force and articles comprising the same" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,909, issued on March 18, was assigned to Dow Global Technologies LLC (Midland, Mich.) and Rohm and Haas Co. (Collegeville, Pa.).

"Multilayer structures with enhanced adhesive bonding force and articles comprising the same" was invented by Gang Wang (Shanghai), Lianjiang Zhao (Shanghai), Jingyi Xu (Shanghai), Xiaobing Yun (Shanghai), Jianping Pan (Shanghai), Gaobing Chen (Shanghai) and Jianliang Zhu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are multilayer structures and articles comprising same. The multilayer structure comprises: a biaxially-oriented polyethylene film comprising a skin layer with a matte surface and a core, ...