US Patent Issued to Dow Global Technologies, Dow Silicones on Oct. 28 for "Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure" (Chinese, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,614, issued on Oct. 28, was assigned to Dow Global Technologies LLC (Midland, Mich.) and Dow Silicones Corp. (Midland, Mich.).

"Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure" was invented by Jiguang Zhang (Shanghai), Yan Zheng (Shanghai), Chao He (Shanghai), Xuedong Gao (Shanghai), Qianqing Ge (Shanghai), Dorab Bhagwagar (Auburn, Mich.), Peng Wei (Shanghai), Chen Chen (Shanghai) and Hongyu Chen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, ...