ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,618, issued on Dec. 30, was assigned to Dow Global Technologies LLC (Midland, Mich.) and Dow Silicones Corp. (Midland, Mich.).
"Thermal interface materials" was invented by Praveen Agarwal (Lake Jackson, Texas), William J. Harris (Lake Jackson, Texas) and Chi-Hao Chang (Midland, Mich.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Thermally conductive compositions include a blocked isocyanate prepolymer composition containing an isocyanate prepolymer blocked with one or more of alkylphenol or alkenylphenol; and an amine composition containing: one or more polyetheramines, and one or more catalysts selected from a group consisting of carboxy late sal...