US Patent Issued to DOOSAN TESNA on Sept. 30 for "Semiconductor chip delamination device and control method therefor" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,371, issued on Sept. 30, was assigned to DOOSAN TESNA INC. (Pyeongtaek-si, South Korea).

"Semiconductor chip delamination device and control method therefor" was invented by Jae Won Cho (Cheongju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, including: a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon; a delamination feeding unit (300) configured to feed a delamination...