ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,738, issued on Nov. 18, was assigned to DOOSAN TESNA INC. (Pyeongtaek-si, South Korea).
"Semiconductor chip delamination apparatus device" was invented by Jae Won Cho (Cheongju-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a semiconductor chip delamination apparatus for peeling off a protective film attached to one surface of a semiconductor chip, the apparatus comprising: a stage unit (400) on which a ring frame, having the semiconductor chip to which the protective film is attached, arranged thereon is mounted; and a fluid delamination unit (1000) for discharging and spraying a delamination actuating...