US Patent Issued to DOOSAN on Sept. 9 for "Adhesive composition, and coverlay film and printed circuit board that include the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,347, issued on Sept. 9, was assigned to DOOSAN Corp. (Seoul, South Korea).

"Adhesive composition, and coverlay film and printed circuit board that include the same" was invented by Kwangseok Park (Yongin-si, South Korea), Euidock Ryu (Yongin-si, South Korea), Inki Jeong (Yongin-si, South Korea), Subyung Park (Yongin-si, South Korea) and Dongho Chae (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutad...