US Patent Issued to DOOSAN on Aug. 5 for "Non-conductive adhesive film for semiconductor package and semiconductor package manufacturing method using same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,448, issued on Aug. 5, was assigned to DOOSAN Corp. (Seoul, South Korea).

"Non-conductive adhesive film for semiconductor package and semiconductor package manufacturing method using same" was invented by Taejin Choi (Yongin-si, South Korea) and Woojeong Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulu...