US Patent Issued to DOOSAN on April 15 for "Underfill film for semiconductor package and method for manufacturing semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,117, issued on April 15, was assigned to DOOSAN Corp. (Seoul, South Korea).

"Underfill film for semiconductor package and method for manufacturing semiconductor package using the same" was invented by Taejin Choi (Yongin-si, South Korea), Chunggu Lee (Yongin-si, South Korea), Sooin Park (Yongin-si, South Korea) and Jungjin Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a pre...