US Patent Issued to DONGGUAN SUNPRO INDUSTRIAL DEVELOPMENT on Sept. 9 for "Split-type case structure that facilitates heat dissipation" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,531, issued on Sept. 9, was assigned to DONGGUAN SUNPRO INDUSTRIAL DEVELOPMENT Co. LTD (Dongguan, China).

"Split-type case structure that facilitates heat dissipation" was invented by Saihua Tang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A split-type case structure that facilitates heat dissipation, comprising a case body, wherein the case body is composed of a power supply case and a motherboard case, wherein the power supply case and the motherboard case are configured to be split, wherein an air intake slot is provided between the power supply case and the motherboard case, and the power supply case and the motherboard case...