US Patent Issued to DMF on Feb. 10 for "Lighting module with keyed heat sink coupled to thermally conductive trim" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,465, issued on Feb. 10, was assigned to DMF Inc. (Carson, Calif.).

"Lighting module with keyed heat sink coupled to thermally conductive trim" was invented by Michael D. Danesh (Carson, Calif.), Benjamin Pin-Chun Chen (Lomita, Calif.), William Wai-Loong Young (La Habra Heights, Calif.) and Amir Lotfi (Redondo Beach, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lighting module includes a heat sink having a sidewall and a partition that defines a first cavity and a second cavity; a driver enclosure disposed in the first cavity and electrically insulated from the heat sink; a driver disposed in the driver enclosure to provide electrical powe...