ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,788, issued on Sept. 9, was assigned to DISCO Corp. (Tokyo).
"Processing method" was invented by Atsushi Komatsu (Tokyo) and Koichi Makino (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cutting method that measures heights of an outer periphery of a wafer, calculates height distribution data, and then calculates change rates of the heights of the outer periphery of the wafer. Based on results of a comparison between the height change rates and a threshold, the cutting method determines whether or not foreign matter exists on a back surface of the wafer (i.e., whether or not foreign matter exists on a holding surface of a chuck table). The ...