ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,370, issued on Sept. 30, was assigned to DISCO Corp. (Tokyo).
"Reinforcement portion processing apparatus" was invented by Yoshinobu Saito (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus includes a reinforcing portion removing mechanism. The reinforcing portion removing mechanism includes a laser beam irradiating unit configured to form a cutting groove by applying a laser beam to a base of a ring-shaped reinforcing portion formed on a periphery of a wafer, a first raising and lowering table configured to hold and raise a frame unit temporarily placed on a temporary placement table, and position the frame unit at the la...