ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,494, issued on Sept. 23, was assigned to DISCO Corp. (Tokyo).
"Processing method of wafer" was invented by Takashi Okamura (Tokyo), Shigenori Harada (Tokyo) and Tomoharu Takita (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom sur...