ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,456, issued on Sept. 23, was assigned to DISCO Corp. (Tokyo).
"Method of manufacturing package device" was invented by Shunsuke Teranishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a method of manufacturing package devices, including a first substrate preparing step of preparing a first substrate in which a device chip is mounted in each of a plurality of mounting areas, a second substrate preparing step of preparing a second substrate including a plurality of recessed portions that are capable of housing the device chips, a bonding step of bonding the first substrate and the second substrate together in such a manner t...