US Patent Issued to DISCO on Sept. 16 for "Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,938, issued on Sept. 16, was assigned to DISCO Corp. (Tokyo).

"Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape" was invented by Takashi Mori (Tokyo), Yoshinori Kakinuma (Tokyo), Jonghyun Ryu (Tokyo), Mitsuru Ikushima (Tokyo), Makoto Saito (Tokyo), Yohei Masuda (Tokyo), Takashi Uchiho (Tokyo) and Yoshinobu Saito (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to th...